High-pressure Compact Laminate (HPL) Façade Panels [Wood-Grain]

BOND BUILDING

 

 

Trespa® Meteon® is a decorative high-pressure compact laminate (HPL) with an integral surface manufactured using Trespa's unique in-house technologies, Electron Beam Curing (EBC) and Dry Forming (DF). The blend of up to 70% wood-based fibres and thermosetting resins, manufactured under high pressures and temperatures yields a highly stable, dense panel with good strength-to-weight ratio's.

 

Usage: Interior partitioning, Façade Cladding